Fleuron™ PR-USF is a biocompatible, viscoelastic negative photoresist with a Young’s Modulus of approximately 5 MPa.

Designed for high-performance lithographic applications. Its softness, combined with its viscoelastic properties, allows it to easily deform under pressure while adapting to stress over time. Fleuron™ features unique dielectric and chemically inert properties, making it ideal for creating micron-scale structures that can encapsulate metallic, fluidic, and various other materials. It resists high temperatures, harsh solvents, and most etching processes ensuring structural integrity at the micron scale.

Compatible with standard 365 nm i-line lithography tools, Fleuron™ integrates seamlessly into existing processes. Its versatility makes it suitable for a wide range of applications, including MEMS, microfluidics, implantable and wearable electronics, and more.

Our photoresist must be cured in an inert environment. We offer a Nitrogen diffuser (see products) that easily attaches to most contact masked aligner systems.

Please Note: For R&D purposes only